GE Fanuc IC694MDL752 High-Density DC Output Module
Quick Facts
| Operating Voltage | 5 VDC (TTL), 12/24 VDC |
| Output Channels | 32 (4 groups of 8) |
| Output Current | 25 mA per point (TTL), 0.5 A per point (12/24 VDC) |
| Group Current Limit | 3.0 A per group |
| Response Time | 0.5 ms |
| Inrush Current | 4.6 A (10 ms) |
| Backplane Current Draw | 260 mA maximum |
| LED Indicators | 32 (one per channel) |
Installation Guide
Mounts in any RX3i I/O slot (single-slot width)
Supports local and remote I/O station installation
Uses Fujitsu 24-pin connectors
Compatible with pre-wired cables IC694CBL327 and IC694CBL328
Extended Technical Data
Voltage Range: 4.75-5.25 VDC (TTL), 10.2-28.8 VDC (12/24 VDC)
On-State Voltage Drop: 0.24 VDC max
Off-State Leakage: 0.1 mA max
Operating Temperature: 0°C to +60°C
Storage Temperature: -40°C to +85°C
Vibration Resistance: 2 g, 5–500 Hz
Compatibility
Works with GE Fanuc / Emerson RX3i CPUs
Supports TTL, 12 VDC, and 24 VDC loads in separate groups
Backward compatible with older automation setups
No products in the cart.
Reviews
There are no reviews yet.